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Silicon material has good chemical inertness and thermal stability, and complex two-dimensional or three-dimensional microstructures can be reproduced with high precision by photolithography or etching methods. However, its fragility, light tightness, poor electrical insulation and high price limit its wider application.

Hicomp’s core technology team has been working in MEMS field for more than 25 years, with 2 senior leaders and dozens of PHDS and masters, and has rich experience in r&d and mass production in sensors, RF devices, microfluidic and biochips, TSV and advanced packaging.

The company has a new thousand MEMS purification production line, and long-term cooperation with mainstream OEM factories at home and abroad, is committed to providing customers with high-quality, one-stop, customized streaming film services, significantly shorten customer research and development cycle and effectively reduce customer costs.

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